Wafer dicing is probably the processes popular in the semiconductor industry. It is a method of separating a die from the wafer of semiconductor and this is accomplished using several methods like scribing and breaking, by mechanical sawing, or by laser cutting. Using wafer dicing machine, wafers are cut into individual semiconductor chips, by making use of dicing blades.
‘ metal dice dicing methods’
Scribing and breaking – usually is done in a substrate manufactured from a brittle material where good-quality cutting surface of the substrate can be achieved without any defects such as chippings on the substrate. This method of semiconductor wafer separation is achieved by developing a stress in the wafer and fracturing the wafer along the stress line. A line should be created in the wafer surface across the street where in fact the break is desired.
Mechanical sawing – the procedure is done utilizing a mechanical machine called dicing saw; this method is used for a micro electro-mechanical system semiconductor devices. While there are still manufacturers that utilize this method, it really is slowly getting unpopular because of several disadvantages – the procedure is slow, contaminant-laden, and influenced by regular shapes.
Laser cutting – a new and more effective technology to cut semiconductor materials; the process functions by directing the output of a high-power laser at the material to be cut. This technique burns or vaporizes away the unwanted parts, leaving an advantage with a high-quality surface finish.
As mentioned above, dicing blades are employed and are an important element for the dicing process. There are numerous types of dicing blades plus some of them are the following:
Hubbed Nickel Bonded Blades – this is used to cut Silicon and III-V materials. This blade is ultra-thin and created using a special electrodepositing technique to contain the cutting diamonds in a nickel alloy matrix.
Hubbed Resin Bonded Blades – with this particular type of blade, there is no need to buy expensive flanges because the resinoid blade is permanently mounted to its own hub. As opposed to flanges, once the blade is dressed, it could be detached and reattached again without going through the dressing process.
Hubless Resin Bonden Blades – this sort of dicing blade performs extremely well on materials like ceramic, quartz, sapphire and glass. This can give minimum chipping and superior finish.
Metal Sintered Dicing Blades – this is a type of blade that is developed by capturing diamonds in a metal binder using sintering process – that is a very rigid blade and contains a very low wear rates. These properties provide ability to create very straight cuts even though subjected to large exposures.